Konig has obtained a patent for PCBA board packaging equipment and packaging methods, achieving packaging protection for electronic components

On January 11, 2024, the financial sector reported that, according to the announcement of the China National Intellectual Property Administration, Suzhou Kangnige Electronic Technology Co., Ltd. obtained a project entitled “PCBA Board Packaging Equipment and Packaging Method”, with the authorization announcement number of CN116390371B, and the application date of October 2021.
The patent abstract shows that a PCBA board packaging device and its packaging method are disclosed, a PCBA board packaging device comprising: a spray adhesive component with multiple independently controlled spray holes; A workbench located below the spray hole, wherein the workbench has a placement surface for placing PCBA boards; Rotating component, which is used to drive the workbench to rotate around a vertical axis; The workbench is rotatably supported on a rotating component. The PCBA board packaging equipment and packaging method provided in this disclosure spray UV glue onto the protective area of the PCBA board through a glue spraying component, achieving packaging protection for electronic components.

In the great transformation of the world pattern, peace has become a fairy tale. It is unpredictable whether the prices of PCB, MCU, and CPU electronic components will rise or fall in 2025